The 18th International Conference on Materials Processing and Characterization (ICMPC 2026) was successfully inaugurated at KIIT Deemed to be University, Bhubaneswar, bringing together distinguished researchers, academicians, industry professionals, and scholars from across the globe to share insights and advances in materials engineering and technology.

Hosted by the School of Mechanical Engineering, KIIT Deemed to be University, in academic collaboration with Gokaraju Rangaraju Institute of Engineering and Technology (GRIET), Hyderabad, the three-day international conference provided a vibrant platform for knowledge exchange, research dissemination, interdisciplinary dialogue, and academic collaboration.

📍 Venue: KIIT Campus, Bhubaneswar
📅 Dates: 6–8 August 2026

The conference featured valuable contributions from researchers and experts working in diverse areas of materials processing, characterization, manufacturing, advanced materials, and emerging engineering technologies.

The School of Mechanical Engineering extends its sincere appreciation to the esteemed Convenors and Editors whose leadership and guidance contributed to the successful organization of this flagship international event:

  • Diptikanta Das, KIIT Deemed to be University, Bhubaneswar
  • Swadesh Kumar Singh, GRIET, Hyderabad
  • Bijaya Bijeta Nayak, KIIT Deemed to be University, Bhubaneswar

ICMPC 2026 celebrates the spirit of research, innovation, collaboration, and excellence in materials engineering.